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Inspection Equipment×ペントロンジャパン - List of Manufacturers, Suppliers, Companies and Products

Inspection Equipment Product List

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Dual-Sided Simultaneous Inspection Device "EAGLE 3D 8800 TWIN"

Dual-Sided Simultaneous Inspection Device "EAGLE 3D 8800 TWIN"

A circuit board inspection device that dramatically reduces time loss through simultaneous inspection on both sides!

The "EAGLE 3D 8800 TWIN" is a 3D AOI (Automated Optical Inspection) device for simultaneous inspection of both sides of a circuit board, equipped with a top camera and a bottom head camera. The drive axis moves the camera head in the X/Y direction without moving the conveyor. This feature provides a very fast, precise, and stable inspection platform. 【Features】 ■ Fusion of speed and measurement technology in full 3D ■ Lane & efficient full-line control ■ 3D image representation rated at the highest level in the world ■ Unique 3D innovation & flexible solutions ■ Operation of top-class 3D technology made easy Additionally, we offer a variety of models, including the post-DIP inspection device "EAGLE 3D 8800TH." *For more details, please download the PDF or feel free to contact us.

  • Circuit Board Inspection Equipment

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[Comparison Data] Printed Circuit Board Surface Appearance Inspection Equipment - Comparison Table *Data Available

[Comparison Data] Printed Circuit Board Surface Appearance Inspection Equipment - Comparison Table *Data Available

Attention PCB personnel! From camera pixels to inspectable items and inspection targets! A comprehensive comparison table of surface inspection equipment for printed circuit boards is now available!

We provide printed circuit board inspection equipment. In particular, our printed circuit board inspection device 'ATHENA' is capable of both 2D and 3D inspections, allowing for the detection of not only surface dents and scratches but also irregularities. It has been adopted by a major semiconductor manufacturer. We have created a comparison document that clearly summarizes our product 'ATHENA' alongside other companies' products. This document is a must-read for anyone involved in printed circuit board inspection. We encourage you to take a look. 【Comparison Document Items (Partial)】 - Camera Pixels - Work Size - Features - Inspectable Items - Inspection Targets *For more details, please refer to the PDF document or feel free to contact us.

  • Other conveying machines
  • Substrate transport device (loader/unloader)

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3D inspection is possible! ~I've never seen a printed circuit board inspection device like this~

3D inspection is possible! ~I've never seen a printed circuit board inspection device like this~

Compatible from bare boards to DIP and assembly boards! Inspection is possible in 3D, allowing for thorough verification of the surface irregularities of the inspection target.

The printed circuit board (raw substrate) surface inspection device "ATHENA" is a new product that enables three-dimensional appearance inspection. With cutting-edge 3D and AI technology, it has become possible to detect defects that were previously invisible. It can simultaneously inspect not only dents and scratches but also land processing defects, resist defects, and silk defects, significantly reducing the labor involved in the inspection process and contributing to cost reduction. It has been adopted by major semiconductor manufacturers and automotive manufacturers, and it is a product with high quality and precision. If you are interested, please feel free to contact us. 【Features】 ■ Spacious design and convenient maintenance ■ Simple assembly and setup ■ 3D formation of high-density components and components in narrow spaces ■ 3D formation identical to real images ■ Improved repeatability accuracy *For more details, please refer to the PDF document or feel free to contact us.

  • Other conveying machines
  • Substrate transport device (loader/unloader)

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Explanatory material "What is Dip Soldering Inspection" *Currently available for free.

Explanatory material "What is Dip Soldering Inspection" *Currently available for free.

Because it's a 3D inspection machine! We explain common questions about dip soldering inspection in an easy-to-understand Q&A format using diagrams and photos! The lineup is also included.

In the process of 3D inspection of the mounting state of electronic components, soldering inspection becomes a particularly production technology-intensive inspection. Soldering inspection has been unable to identify defects due to the influence of irregular reflection (noise, etc.) on the solder surface and FLUX, but PEMTRON has overcome these issues with the cooperation of many users. This document will explain the inspection content, particularly focusing on the challenging soldering dip inspection of inserted components. [Contents] ■ Soldering inspection machines for inserted components (product lineup) ■ What is DIP soldering inspection 1-5, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Other conveying machines
  • Substrate transport device (loader/unloader)

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3D Appearance Inspection Machine for Raw Substrates 'ATHENA'

3D Appearance Inspection Machine for Raw Substrates 'ATHENA'

Inspection equipment that supports the quality inspection process of printed circuit board suppliers!

"ATHENA" is a 3D appearance inspection machine for printed circuit boards (raw substrates) that utilizes unique 3D inspection technology and advanced lighting technology to achieve surface appearance inspection and measurement that was impossible with conventional 2D inspections. By inspecting invisible defects in 2D and 3D, it supports the quality inspection processes of printed circuit board suppliers. Thanks to moiré technology, it can detect dents, bubbles, foreign objects, and other issues in 3D that cannot be found through 2D inspections. 【Features】 - Surface appearance inspection and measurement with advanced technology: 2D lighting, 3D lighting, coaxial lighting - High-speed 3D inspection and measurement - Surface inspection (2D, 3D, AI): defect inspection of substrates - More detailed inspection of the field of view (FOV) - Inspection based on substrate information (Gerber data) *For more details, please download the PDF or feel free to contact us.

  • Circuit Board Inspection Equipment

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Substrate Appearance Inspection Device "EAGLE 3D 8800 Compact"

Substrate Appearance Inspection Device "EAGLE 3D 8800 Compact"

We contribute to improving production quality through a variety of inspections!

The "EAGLE 3D 8800 Compact" is an optical 3D AOI (Automated Optical Inspection) device for inspecting the assembly and soldering condition of electronic components mounted on PCBs through the processing of three-dimensional image data. In addition to the inspection items of existing 2D AOI machines, such as component placement inspection, optical character inspection, and pattern inspection using 2D images, it is equipped with items that can only be inspected with 3D AOI, such as lead lifting, utilizing three-dimensional height data. 【Features】 ■ 8-Way Projection + 3-Stage Lighting ■ Simultaneous inspection with 2D and 3D algorithms ■ Equipped with telecentric lenses for improved precision and detection capability ■ High-performance PC: equipped with a high-speed CPU and high-speed graphics processor ■ User-friendly UI *For more details, please download the PDF or feel free to contact us.

  • Circuit Board Inspection Equipment
  • Visual Inspection Equipment

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DIP post-inspection device "EAGLE 3D 8800TH"

DIP post-inspection device "EAGLE 3D 8800TH"

Inspection with ultra-high-definition 3D images is possible! We provide a very stable and precise inspection platform.

The "EAGLE 3D 8800TH" is an inspection device that employs a pin shape recognition program specialized for DIP inspection. It features a unique system that does not require board inversion and a bottom head camera, achieving overwhelming inspection performance compared to conventional products. Additionally, it utilizes an algorithm specifically designed for through-holes, providing a very stable and precise inspection platform. 【Features】 ■ Unique system that does not require board inversion and bottom head camera ■ Achieves overwhelming inspection performance compared to conventional products ■ Capable of inspection with ultra-high-definition 3D images using new technology ■ Employs a pin shape recognition program specialized for DIP inspection ■ User-friendly with a simple interface *For more details, please refer to the PDF materials or feel free to contact us.

  • Visual Inspection Equipment

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Coating Inspection Device "TROI-8800CI Series"

Coating Inspection Device "TROI-8800CI Series"

The dual-sided inspection function is possible through the inverter! Coating thickness measurement device.

The "TROI-8800CI Series" is an inspection device capable of measuring coating film thickness through a precise measurement method that utilizes the refraction of light. It features a user-friendly UI and simple programming for user convenience. By sharing inspection result information and enabling automatic linkage, it can be utilized for quality control and quality improvement. 【Features】 ■ User-friendly UI and simple programming ■ Auto teaching and automatic debugging ■ Sharing of inspection result information and automatic linkage ■ Utilized as a tool for quality control/quality improvement ■ Reads Golden Board *For more details, please refer to the PDF materials or feel free to contact us.

  • Visual Inspection Equipment

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Explanation material: "Introduction to Quality Control Made Possible by 3D Inspection"

Explanation material: "Introduction to Quality Control Made Possible by 3D Inspection"

A detailed introduction to the inspection items and inspection content for soldering dip inspection of difficult-to-solder insert components, including diagrams and photos! *Currently available for free.

In the process of 3D inspection of the mounting state of electronic components, soldering inspection becomes particularly a test that requires production technology elements. Soldering inspection could not identify defects due to the influence of irregular reflections (such as noise) on the solder surface and FLUX, but PEMTRON has overcome these issues with the cooperation of many users. This document will explain the inspection content, particularly focusing on the challenging dip inspection of inserted components. [Contents] ■ Defect Inspection ■ Defect Items ■ Image Samples ■ Inspection Content *For more details, please refer to the PDF document or feel free to contact us.

  • Other conveying machines
  • Substrate transport device (loader/unloader)

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[Explanatory Material] ATHENA Surface Inspection Equipment

[Explanatory Material] ATHENA Surface Inspection Equipment

2D lighting is composed of three-stage RGB lighting and coaxial lighting! It enables defect detection with lighting from diagonal and low-angle perspectives!

This document is an explanatory material about the surface inspection equipment "ATHENA." It explains features such as "PEMTRON equipment specifications," "characteristics of 2D lighting," "3D moiré technology," and "3D inspection of PCB surface irregularities," using images. There are plenty of images showing defect detection, including "scratches and protrusions," "etching defects and protrusions," and "contamination." Please take a moment to read it. 【Contents (partial)】 ■ PEMTRON equipment specifications ■ Features of Pemtron 2D lighting ■ Features of Pemtron coaxial lighting ■ Features of 2D and coaxial lighting ■ 3D moiré technology *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit Board Inspection Equipment

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